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Soder-Wick Rosin Flux No Clean Solder Desolder Braid 0.8mm 5FT CHE6015


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SKU: 9339Tags: Soder-Wick

Soder-Wick No Clean Desolder Braid is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

Soder-Wick No Clean Desolder Braid Features & Benefits

  • Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Patented noncorrosive, halide free, organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
Soder-Wick No Clean Desolder Braid Applications
  • Soder-Wick No Clean SD safely removes solder in all applications requiring Type ROL0 flux
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Soder-Wick No Clean Desolder Braid Size

0.030"/0.8mm width
5' / 1.5 m length 
No Clean - white label on SD bobbin

Soder-Wick No Clean Desolder Braid Resources
(Please click title to download)

Safety Data Sheet

Technical Data Sheet

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